Product Main

Specifications

Material: FR4, 8-layer board
Final thickness: 1.6mm
Surface treatment: ENIG

PCB Capability:
Max Layer Count for rigid PCB:        1-12
PCB Board Thickness:                 14mil -175mil
Drill to Metal:                        7mil
Hole Size:                            6mil
Inner layer Registration:               3mil
Line Width & Space Inner/Outer:       3mil/3mil (minimum)
Aspect Ratio:                        </= 12:1
Min Solder mask Dam:                2.5mil
Controlled Impedance:                +/- 8%
Max Internal Copper Wt.:             3 oz
Advanced Technologies:               Blind/Buried Via, HDI Micro via
Surface Treatment:                   ENIG, OSP, Immersion Silver/Tin, Lead free HAL
Materials:                           FR4,High Tg Epoxy,Halogen Free
Certificates:                         TS16949, ISO14001 and UL
Price:                              Quite competitive especially for orders in huge quantities
Products application:                 Computer, Communication, Test & Control system, Medical Equipment etc.
Lead Time:                         5-20 days (Depends on Q’ty, production status etc.)
Delivery Mode:                      UPS, DHL, Fedex, TNT, standard flight & vessel