Our PCB (Printed Circuit Board)Technical Specifications:
- Base material: FR4, Aluminum, Ceramic,Rogers, F4BK, F4BT, TP, PF, CEM-1, CEM-3, etc
- Board thickness: 0.30 to 3.20mm (12 to 126mil)
- Copper thickness: 0.50 to 5 ounce
- Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
- Minimum line width: 0.075mm (3mil)
- Minimum line space: 0.075mm (3mil)
- Minimum hole diameter: 0.10mm (4mil)
- PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
- NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
- Maximum board size: 460 x 620mm (18 x 24)
- Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers.
- Base material: FR4, Aluminum, Ceramic,Rogers, F4BK, F4BT, TP, PF, CEM-1, CEM-3, etc
- Board thickness: 0.30 to 3.20mm (12 to 126mil)
- Copper thickness: 0.50 to 5 ounce
- Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
- Minimum line width: 0.075mm (3mil)
- Minimum line space: 0.075mm (3mil)
- Minimum hole diameter: 0.10mm (4mil)
- PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
- NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
- Maximum board size: 460 x 620mm (18 x 24)
- Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers.
Our PCBA service:
- Strong sourcing ability in relative parts and components
- Active and passive components source is directly from original manufacturer
- High-precision 0402 size components SMT technology and lead-free
- RoHS compliant SMT and wave solder process
- Experienced technical staffs in charge of product design
- Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
- IC pre-program
- Full experienced QC and inspector
- Enclosure cabinet case plastic injection molding, metal stamping, manufacture and assembly
- High-precision E-Testing include: ICT, BGA repair device, function test.