Technical parameters:
Model
|
HW YAG-ZJ50-II
|
Laser output power
|
≤50W
|
Laser wavelength
|
1064nm
|
Beam quality m2
|
<6
|
Laser repetition rate
|
≤50KHz
|
Standard engraving range
|
50*50mm.100*100mm.110*150mm
(can chose)
|
Optional engraving range
|
70mmX70mm/150mmX150mm
|
Carving depth
|
≤1.50mm
|
Complete machine power
|
1.5KW
|
Minimum line width
|
0.015mm
|
Repeat accuracy
|
±0.0025mm
|
Carving line speed
|
≤7000mm/s
|
Size of the host system
|
1220mmX650mmX1200mm
|
Minimum character
|
0.3mm
|
Feature:
1: the British import ceramic condenser chamber, high temperature, corrosion resistance, long life (8-10 years), photoelectric conversion efficiency, were less than 3mm deep engraving table without having to adjust focus down, one-time sculpture is 1mm with more than 3 times the industry rate.
2: laser power, energy may be current, software control, continuously adjustable.
3: low processing costs, ink and other printing supplies without.
4: use of scanners, high speed, high precision and stable performance.
5: 24 hours of continuous work.
6: Engraving depth: 5mm deep aluminum can sculpture, steel sculpture 3mm deep can be.
7: carving fast: 10 minutes 5 mm X 5mm steel plate engraving 0.6mm deep
Applicate:
1; can be engraving metal and a variety of non-metallic materials. Some of the requirements is more suitable for fine, high precision processing.
2; used in electronic components, integrated circuits (IC), electrical appliances, communications, hardware, tools, accessories, precision instruments, eyeglasses and clocks, jewelry, auto parts, plastic buttons, construction material, PVC pipe, medical equipment, etc. .
3; application materials include: ordinary metals and alloys (iron, copper, aluminum, magnesium, zinc and all other metals), rare metals and alloys (gold, silver, titanium), metal oxide (metal oxide may be), special surface treatment (phosphate, aluminum anodizing, plating surface), ABS material (electrical appliances, housing, commodities), ink (translucent button, print products), epoxy resin (electronic components, packaging, insulation layer.