Copper Electroplating Intermediates
SPS Bis-(sodium sulfopropyl)-disulfide CAS NO.27206-35-5, C6H12Na2O6S
BZ Strong leveling agent for acid copper plating can be obtained decorative and functional coatings.
AP-14 Polyether compound, Leveling, and take place excellently.
HGS Strong agent and uniform plating, with scattered strongly, bright mirror coating etc.
PE-2 Brightener, stronger leveling agent in nickel bath
BA Brightener, stronger leveling agent in nickel bath
LZ-1 Blue dye Sulfur phthalocyanine dye, Acid copper leveling agent
LZ-2 Purple dye Dye aggregation phthalazine, Acid copper leveling
LZ-3 Yellow dye Alkaline Yellow, Acid copper filling agent
MPS 1-Propanesulfonic acid, 3-mercapto-monsodium salt CAS NO. 17636-10-1, C3H7NaO3S2
UPS3-S-Isothiuronium propane sulfonate CAS NO. 21668-81-5, C4H10N2O3S2
EDTP(Q75) N,N,N',N'-Tetrakis (2-hydroxypropyl) ethylenediamine, CAS NO. 102-60-3, C14H32N2O4
1,3-PS 1,3-Propane sultone, CAS NO. 1120-71-4, C3H6O3S