| Listing Description |
Advantages ; -. Full Automatic -. High throughput -. Wafer size auto conversion -. Different recipe per wafer |
|---|---|
| Detailed Description |
Description
Advantages ;
-. Full Automatic
-. High throughput
-. Wafer size auto conversion
-. Different recipe per wafer
-. Easy operation by G.U.I environment
-. High speed two wafer transfer robot
-. Flexible configuration
Specification
Wafer size : Up to 12’
Max.4-spin (1 Block)
HP,CP,AD Unit (Max.24unit)
Spin RPM : 0~6,000 rpm
Side & Back Rinse nozzle
Various Nozzle
- Nano spray/ High pressure /brush/Sonic
Window based operating system
Wafer size : Up to 12’
Max.4-spin (1 Block)
HP,CP,AD Unit (Max.24unit)
Spin RPM : 0~6,000 rpm
Side & Back Rinse nozzle
Various Nozzle
- Nano spray/ High pressure /brush/Sonic
Window based operating system
|
