Description
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ASP2000X is equipment in the photolithography process which coats and develops for patterns on wafer.ASP2000x is specifically designed for ease of use and low cost performance for a wide-range of semiconductor substrate processing.
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Specification
Wafer size:Up to 12"
Max.4-spin(1 Book)
HP,CP,AD Unit(Max.24unit)
Spin RPM:0~6000rpm
Pre-Thinner/EBR/B.R nozzle
WEE&Inline to stepper
Window based operating system
Advantages ;
Different recipe per wafer
Wafer size auto conversion
High speed two wafer transter robot
Easy operation by G.U.I environment
Full Automatic
High throughput
Flexible configuration
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Coating & developing process
PIQ/SOG Process
MEMS/LED
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