This Fine Spray nozzle was developed for fine spray machine for wafer, glass and film substrate.

Spray solution will be photo resistor, solvent and gasoline which have various viscosity solutions and flammable or nonflammable.

1. It is possible to do spraying the micron powder, high viscosity liquid, Slurry, emulsion which is could not do spraying in the conventional spraying

 

2. It is not necessary to mix with exterior solution in one pot and when mixing the spray solution before coating. So the Internal lane of nozzle is straight.

 

3. The structure of nozzle is extremely simple.

Component of nozzle is 2 kinds, so it is very easy to do maintenance.

 

4. It is possible to spray the micro powder with high efficiency. It is very low consumption of pressing air to spray compare with the past conventional nozzle.

 

5. It is very strongly much optimized to spay the multi solution of agent in one time. Each solution of pipe connect to the nozzle direct and mixing and spraying on the tip of Nozzle.

 

6. The dimension of nozzle tip is extremely small.

The installation of Nozzle is nozzle and Sparing tip can be fixed with screwing itself to easy install.

 

7. Application will be the process and equipment required chemical resistance and environment free system.

 

8. One system controller can control spraying width, speed and other spraying conditions which can be set up easily from the amount of liquid solution, spraying air and flow control.

Applied the spraying machine for wafer, and supplied to big semiconductor in Korea.