Supercritical Clean & Drying system which uses supercritical CO2 is designed for Cleaning and drying ultra fine structures \. It is environment friendly cleaning and drying system also does not make any pollution when cleaning.

With its low viscosity, surface tension and high diffuseness, supercritical CO2 is able to penetrate even into very narrow and deep openings.

Advantages ;

-. Environmental compatibility

-.Emerging technology

-. CO2 Recyclable (Low CoO)

-. High throughput(240wph)

-. Compatible with multi chamber operation and multi wafer loading

Wafer Size : Up to 12”

10wfs / 1chamber

Control Temp & Pressure: ~ 100°C, ~300bar

Wafer cleaning ( Semiconductor & Solar wafer)

Photo resist stripping

Photo resist developing

MEMS/NEMS Drying

Film deposition / Etching

DRY photo lithography

This system was developed with Government project for Green Project ( Environment Protection for Semiconductor Process )