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Specifications

Description
High Vacuum sputtering coating for thin film ;
1)ITO Film coating
2)Solar energy applications film
3)Barrier coating for film
4)Other thin coating
 
 Specification
- Chamber Material : Stainless Steel [SUS 304L]
- Main Pump : Cryogenic pump, Turbo pump, Diffusion pump, etc.
- Winding Speed : 0.1~10.0m/min
- Substrate : Glass, Film[PET,PI,PC], Plastic[Acryl, Teflon], Textile, etc.
- Target : Metal -Al, Cr, Ni, Mo, Au, Ag, etc.
  Oxide - ITO, SiO2, TiO2,Nb205 etc.
- Adhesion : 100%[Taping test]
- Control System : Controller [PLC + PC Base],
Manual/Auto Selection Function, Data Feedback & Real Time Display Function
-. Substrate thickness : 20 ~ 300 micron
-. Substrate width : Max 1600 mm
-. Sputtering type : DC magnetron Sputter, MF magnetron Sputtering
-. Power supply : DC 10 KW, MF 40 KW
-. Resistance uniformity : 400 oh +- 5%
-. Thickness Uniformity : 20 nano  +- 5%
-. Pretreatment : DC bombardment or Ion Beam
-. Single side coating
 
 Advantages of Products
Optimized chamber design for the best vacuum condition
 Differential pumping for each separated zone
Stable driving mechanism & high uptime