Product Main

Specifications

Description

 

1) Aiming for the grinding technology development of precision molded ion-beam, it is applicable for the uniformity ion-beam grinding processing development and surface mold
    Process.
2) Manufacture the production device and develop mass-production for the large-sized ion beam
 
 Specification

 

1) Establish grinding process for the ideal ion-beam depends on the surface roughness Xe+ , 15kV, 150 μ A/cm2 , 60°C, 2 hours -> decreased to 200~ 300nm
2) Ion-beam surface grinding around 200~300nm Xe+ , 5kV, 150 μ A/cm2 , 45°C, 4 hours -> decreased to 100nm
3) Ion-beam surface grinding around 100nm Xe+ , 5kV, 150 μ A/cm2 , 60°C, 1 hour -> decreased to dozens of nm
 
 Application

 

1) Processing substitution of the general mechanical polishing such as the general mold and the optical instrument mold (back light unit, mobile case and etc.)
2) STEMPER such as general mold and the pattern within the optical instrument mold (general -> optical science included), and the additional polishing processing on the polishing     core surface
3) Nano polishing process on the precision processing parts of general mold and the optical instrument mold
4) In case of processing high roughness of surface, stability of the injection shape of mold and the maintains the precision of the injection machine itself.