l Linear Sources type and Round ( multi cell ) sources type

l Linear Type ;

-. Race track shaped emission slit to magnetron discharge zone.

-. The metal housing is grounded.

-. Source can be installed inside vacuum chamber or on flange.

-. Water cooling tubes are fed thru 2 smaller flanges

-. Power supply ; Max 1.5KV, 16 Amp, Max pwr 12kW

-. Electrical power is connected to the anode cooling tubes.

-. Gas manifold distributes gas evenly along the Sources.

-. Permanent magnet used.

-. Anode is made of non-magnet stainless steel.

-. The length of Source is not limited.

n  Products feature :

-. Grid less Ion sources.

-. Ion sources with an anode layer

-. Absence of Particle contaminations

-. The long maintenance period(; almost free )

-. Closed drift thruster design (1960’s Russian technology)

-. Adhesion improvement before metalizing

 

l  Linear anode layer source with closed drift type

 -. Working Gases ; Ar, N2, O2, Ch4, CO2, CF4, NH3, air etc…

 -. Beam emission Aperture length : 150 ~ 3,500mm

 -. Beam emission aperture width : 150 mm ~ 200mm

 -. Ion beam Energy ; 400eV ~ 2500 eV depend on design

 -. Angle divergence: 2 Q ≤ 30 deg

 -. Ion beam Current : 150mA ~ 3000mA

 -. Current Density at slot output : 5 ~ 10 mA / cm of length

 -. Anode Voltage : 500 V ~ 3000 V

 -. Consumption current : 0.5 ~ 3 A

 -. Gas flow rate : 10 ~ 100 sccm

 -. Cooling water flow : Up to 10,000ccm, below 18 deg. C,

 2-4 bar

 -. Operation pressure : 5*10 E-2 ~ 5*10 E-1 Pa

 -. Maintenance Interval: ≥5,000 Hrs

 

 -. For deposition Rate ;

   (Typically achieved 10Å/Sec ±5% with 40 ~ 50Å thickness )

Linear type  : 45~100Å /4 fpm ( feet/minute ) @ discharge 1.0 kV, 0.8A with using argon beam

 

 -. For Etcher ; etching rate ;

Linear type etcher :

Hi Vtg mode ;  1.5 Å / 4 fpm ( feet/minute )

Low Vtg mode ; 50 Å / 4 fpm ( feet/minute )

 

l  Linear Sources Applications;

 -. Ion Beam Cleaning before sputtering ( Lens, ITO glass, , LCD glass, Solar wafer, window glass, plastic, coater . etc )

 _. Ion cleaning of flexible substrate ( PET, PEN, PI.. etc ) before coating deposition on roll

 -. Web Coater ( Roll to Roll film type coater )

-. In line disc production system

-. Etcher of Silicon wafer with Ar beam