Product Main

Specifications

Full automatic electro plating system so it makes fine and clear quality PCB
Specification
Full automatic plating system so it makes fine and clear quality PCB ; Process ; Unloading – pre cleaning – Copper plating by CuSo4 – unloading – packing – delivery
•      Equipment Size  : ->5.0m(W) * 3.5m(H)
•       Board Thickness : ->0.05t – 2.0t
•       Board Size : ->(W)280 ~ 510mm,  (H)340 ~ 620mm
•       Plating Thickness : ->±10%
•       Current Density : ->2.3A/d㎡
•       Plating Time : ->15 – 120min
•       Product CAPA(M) : ->5,000 – 12,000㎡

Advantages of Products
Vertical and Carrier system we have


Practical applications of the product
For PTH ( Plated Through Hole)
for Blind Via Hole
For Flexible Printed Circuit Board
For Via Filling
For Fine Pattern
For Laser Via Hole