Product display workstation < < BGA sirocco repair KID - R600
1, the device type KD - R600
2, the largest size: W550 * D500mm PCB
3, PCB thickness: 0.5 ~ 2.5 mm
4 and 1:1 for chip * * * * * * * * 70mm ~ 1970s
5 and applicable chip minimum distance: 0.15 mm
6 and pasted on the maximum load: 500g
7 and pasted on accuracy ± 0.01 mm.
8 and PCB localization way: appearance
9 and workbench fine-tuning and ± 15mm around, : 15mm ± 10, temperature control mode: K type thermocouple, 11, the closed-loop control air heating: hot 800W
12, upper air heating: hot 1200W 110V (13) : 3600W infrared preheating, bottom
14 and use of single-phase 220V power: 50/60Hz, 15, machine W750 * * * * * L850 size: H630mm 16, weight: about 80KG machine
2, the largest size: W550 * D500mm PCB
3, PCB thickness: 0.5 ~ 2.5 mm
4 and 1:1 for chip * * * * * * * * 70mm ~ 1970s
5 and applicable chip minimum distance: 0.15 mm
6 and pasted on the maximum load: 500g
7 and pasted on accuracy ± 0.01 mm.
8 and PCB localization way: appearance
9 and workbench fine-tuning and ± 15mm around, : 15mm ± 10, temperature control mode: K type thermocouple, 11, the closed-loop control air heating: hot 800W
12, upper air heating: hot 1200W 110V (13) : 3600W infrared preheating, bottom
14 and use of single-phase 220V power: 50/60Hz, 15, machine W750 * * * * * L850 size: H630mm 16, weight: about 80KG machine