Number of Layers :      1-16Layers
Min.Board Thickness :   (2-layer-- 0.2mm ;4-layer-- 0.4mm ;6-layer -0.6mm ;8-layer --0.8mm ;10-layer -

-1.0mm )
Min Line Width/Space :  3.5mil/4mil(0.0875/0.1mm)
 Min.S/M Pitch:        0.1mm(4mil)
Finish Hole (Mechanical) :    0.2mm--6.30mm
PTH Wall Thickness :   >0.025mm(1mil)
Hole Dia.Tolerance(PTH):      ±0.075mm(3mil)
 Hole Dia.Tolerance(NPTH):     ±0.05mm (2mil)
 Hole Position Deviation:        ±0.05mm (2mil)
 Outline Tolerance:          ±0.10mm (4mil)
 Twist&Bow :          ≤0.7%
 Insulation Resistance :       >1012Ω Normal
Through hole resistance :       <300Ω Normal
 Electric strength :         >1.3 kv/mm
 Current breakdown :     10A
Peel strength :      1.4N/mm
 S/M abrasion :     >6H
 Thermal stress :      288°C 20 Sec
 Test Voltage :      50-300V
 Min. blind/buried via :    0.2mm (8mil)
 Available Laminates Material:      FR-4, High TG FR-4(TG150,TG170), Aluminum Base, Halogen

Free,Rogers(Ro4003,R04350,R6006)
23 Finished board thickness tolerance :    T>=0.8mm,Tolerance:+/-8%,T<0.8mm,Tolerance:+/-10%
 Out Layer Copper Thickness :       1oz--5oz
 Inner Layer Copper Thickness :     1/2oz--4oz
SMT Mini. Solder Mask Width :   0.08mm
 Mini. Solder Mask Clearance:     0.05mm
 Plug Hole Diameter:          0.2mm--0.60mm
 Impedance Control Tolerance :    +/-10%
 Surface Finish :    HASL,HASL Leadfree,Immersion ENIG,Chem. Tin,Flash Gold,OSP,Gold

finger,Peelable,Immersion Silver
Insulation Layer Thickness :     0.075mm--5.00mm
Special technology :    Impedance control PCB,Blind/Buried PCB,