FPC-Double-Sided Single-Sided Multilayer
Number of Layers : 1-16Layers
Min. Board Thickness : (2-layer-- 0.2mm ; 4-layer-- 0.4mm ; 6-layer -0.6mm ; 8-layer --0.8mm ; 10-layer -

-1.0mm )
Min Line Width/Space : 3.5mil/4mil(0.0875/0.1mm)
Min. S/M Pitch: 0.1mm(4mil)
Finish Hole (Mechanical) : 0.2mm--6.30mm
PTH Wall Thickness : > 0.025mm(1mil)
Hole Dia. Tolerance(PTH): ± 0.075mm(3mil)
Hole Dia. Tolerance(NPTH): ± 0.05mm (2mil)
Hole Position Deviation: ± 0.05mm (2mil)
Outline Tolerance: ± 0.10mm (4mil)
Twist& Bow : ≤ 0.7%
Insulation Resistance : > 1012Ω Normal
Through hole resistance : < 300Ω Normal
Electric strength : > 1.3 kv/mm
Current breakdown : 10A
Peel strength : 1.4N/mm
S/M abrasion : > 6H
Thermal stress : 288° C 20 Sec
Test Voltage : 50-300V
Min. Blind/buried via : 0.2mm (8mil)
Available Laminates Material: FR-4, High TG FR-4(TG150, TG170), Aluminum Base, Halogen

Free, Rogers(Ro4003, R04350, R6006)
23 Finished board thickness tolerance : T> =0.8mm, Tolerance: +/-8%, T< 0.8mm, Tolerance: +/-10%
Out Layer Copper Thickness : 1oz--5oz
Inner Layer Copper Thickness : 1/2oz--4oz
SMT Mini. Solder Mask Width : 0.08mm
Mini. Solder Mask Clearance: 0.05mm
Plug Hole Diameter: 0.2mm--0.60mm
Impedance Control Tolerance : +/-10%
Surface Finish : HASL, HASL Leadfree, Immersion ENIG, Chem. Tin, Flash Gold, OSP, Gold

finger, Peelable, Immersion Silver
Insulation Layer Thickness : 0.075mm--5.00mm