(1) Function: it is used for collection of wafer bits from the cutting machine. In the wafer line there is wastage from the cutting process which needs to be reused in order to minize the overall wastage of wafer baking systerm to 2 %. This equipment is used for griding the discarded wafer in to reusable form. The ground material can be used with cream. The smashing or griding machine is constructed out of stainless steel marteial to maintain hygiene of reusable product. The grinding systerm is driven by 3 kw motor to have high power and efficiency.

(2) Operating Instruction

Put the wafer waste to the mixing tank until it is full, close the tank lid, and mix for 30~60 seconds. Cut off the power, open the lid if the mixing stops, and turn the tank for 90 ° And take out the wafer power, the power can be resured with cream after sieved by 16~20 mesh screen