Silicone
electronic potting silicone for electronic products technical guidelines:

1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.

2, Mixing Ratio: part A: part B = 1:1

3, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes. Then the mixture could be used for pouring.

4, Pls note that the thickness of the silicone affects the curing time. If the silicone used is a little thick, then the curing time will be a little longer. The temperature also affects the curing time. When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. With temperature of 80~100° C, the silicone will cure in 15 minutes; while in 25° C room temperature, the silicone will cure around 8 hours.

 

Notes:
1. The following material may hinder the curing of HY 9055, So pls use after the test. When necessary, pls clean the application areas.

L Organotin compound or Condensation silicone with organotin

l Sulphur, sulfide and sulfur rubber materials.

L Amine compounds as well as contains the amine materials.

L Pewters solder flux

 

2. HY 9055 should be sealed storage. The mixture should be used up disposably to avoid causing waste.

 

3. HY 9055 belongs to non-dangerous goods, but keep away from mouth and eyes.

4. When it gets stratified after a period of storage, Please mix it evenly before using, which does not affect the performance.

PACKAGE
20Kg/pail as a set (Part A 10Kg + Part B 10Kg)