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Specifications

Ceramic DPC/DBC
Materials: Al2O3, AlN
Coating matel and circuit diagram for any drawing
Metal: any such as Cu,Ni,Au....
Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)others & produce final circuit
coating:0.03um to 5mil
Ceramic Metallized substrate:
Al2O3 substrate metallized
AlN substrate metallized
Silicon wafer metallized
LED heat-dissipation ceramic substrate:
LED Al2O3 thin film substrate
LED Al2O3 thick film substrate
LED AlN thin film heat-dissipation substrate
Flip chip substrate:
The integration of the thin film,thick film,electrode plating and electroless plating processes: