· Country of Origin: China (mainland)
· Vendor to be UL recognized to minimum category of 94V0
· Fabricated in accordance with IPC_A_600, latest version unless otherwise specified in attached specification.
· All patterns according to Customer PCB Artwork/Film/Gerber File.
· Material: FR_4 other
· We would provide a copy of UL materials certificate.
· Weight of Copper: 1 oz per sq . ft(Base Material)for Outer Layers. Finish to be 2oz per sq. ft oz per sq. ft(Base Material)for Inner Layers.
· Finished Board thickness shall be(Tolerance is ± 10%): 0.8mm 1.0mm 1.2mm 1.6mm Other
· Finishing according to IPC_TM_650(2.2.13)latest version.
· Via Method: PTH NPTH Blind Via between layer
· PCB must be identified with MFR’ S approval logo, type designation week and year(WWYY) OF MFR and Customer P
· MFR’ s UL Logo& indicated location According to PCB Drawing of Gerber data
· Date code location: Print on Top/Bottom Side Silkscreen Layer
· Etch on Top/Bottom Side Copper Layer.
· Customer Part No. & Silkscreen Layers According to PCB Drawing or Gerber data indicated location.
· All PCB will be electrical tested before shipment
· Other Test and Reliability standard refer to IPC_A_600(latest version)PCB Class1 Class2 Class 3
· As per ion_contamination test results. (IPC_TM_650 Test Method2.3.25)
· Finishing: HAL ENTEK Pre_flux Gold Flash Gold Plating Immersion Tin Immersion Silver Immersion gold
· Min. hole size: 12mil or mm(Remark: The minimum hole size are for drill bit size)
· Legend Silkscreen: Top or Bottom side
· Legend marking do not allow printed on soldering pad and must keep clearance 10 mil min, leave to the soldering pad
· Silkscreen color: White Yellow Black
· We will provide specification & Materail Safety Data Sheet(MSDS) of legend ink
· Soldermask: Wet film Dry film Conventional Peelable
· Plug all via holes by soldermask on Top Side or Bottom Side
· Soldermask color: Green Blue Yellow Red Other
· Fabrication: Routing Punching Handmade
· All sample board and risk buy order will be acceptable for routing
· PCB Unit/Panel size: 163.3X215.6inch/mm
· Comply RoHS standard
· Packing: handwork package
Inner packing: vacuum package
Outer packing: carton
Inner packing: vacuum package
Outer packing: carton
· Pattern Comparison :All patterns according to PCB Artwork/Film/Gerber File.
· Trace & Space Width Within ± 20% per artwork.
· Conductor Nicks, scratches or pinholes < 20% of nominal width
· E_test Mark Must be present after Electrical Test.
· Hole Sizes :Guide Holes _Measuring all, all according to Fab Dwg.
PTH _Sampling at least 10 of evenly distributed holes of each hole size, all
according to Gerber file or hole charts. NPTH _For punch holes, the tolerance ± 0.1mm. For drill holes, the tolerance ± 0.05mm.
PTH _Sampling at least 10 of evenly distributed holes of each hole size, all
according to Gerber file or hole charts. NPTH _For punch holes, the tolerance ± 0.1mm. For drill holes, the tolerance ± 0.05mm.
· Outline Dimensions: All dimensions according to Fab Dwg
· Guide Holes Locations: All guide holes locations according to Fab Dwg
· V_Cut: Distance of 2 V_Cut tips along H_plane of PCB < = 0.1mm Distance of 2 V_Cut tips along V_plane of PCB < = 1/3 T,
where T = thickness of PCB, unless otherwise specified by Fab Drawing
· Bow and Twist: Placing both sides in a flat surface, the highest point of both sides to the diagonal length < 1% for non_SMT and < 0.75% for SMT PCBs.
· Conductor Thickness Evaluation (Micro section or Radioactive Equipment): PTH wall and trace Cu finishing thickness > 0.025mm Pb/Sn thickness > 0.002mm (HAL) Au thickness > 0.076µ m (Au PCB) > 0.76µ m (Au finger) Ni thickness > 1.3µ m (Au PCB) > 3.8µ m (Au finger)
· Solvent Resistance: IPC_TM_650 (2.3.23) No attack
· Solder ability: ANSI/J_STD_003 100% for Non_SMT, 95% for SMT