Product Features:
1. Excellent viscosity stability
2. The viscosity changes are seldom and could be recycled to use
3. Keep good stickiness and stability for a long time
4. It will not appear collapse, bridge joint or solder ball splash in the operating process
5. Effectively reduce the incidence of solder holes, void and solder ball
6. Can also meet the requirements even without cleaning
Business Purpose: Adhering to the principle “Quality first, provide 100% satisfied products for the customer”. Dedicated services to all the customers.
Applicable Scope:
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Model
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HSC-4H
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HSC-4A
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Test Method
|
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Suitable for Printing Spacing(mm)
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HSC-4H : ≥0.3
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≥0.3
|
-
|
|
Slump-in-printing
|
0.2mm
|
0.2mm
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JIS Z 3284 - 7
|
|
Slump-in-heating
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0.3mm
|
0.3mm
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JIS Z 3284-8
|
|
Tackiness
|
24hr
|
24hr
|
JIS Z 3284-9
|
|
Fluidity Characteristic
|
0.58～0.68
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0.05～0.06
|
JIS Z 3284-6.5.2
JIS Z 3284-6
|
|
Migration Test
|
No
|
No
|
JIS Z 3284-14
|
|
Spreading %
|
＞80
|
＞75
|
JIS Z 3197-8.3.1.1
|
|
Viscosity Pas
|
190～230
|
180～220
|
Malcom PCU-205:10rpm 3min
|
|
Melting Point℃
|
216～221
|
216～221
|
-
|
|
Solder Ball Test
|
Level 1～3
|
Level 1～3
|
JIS Z 3284-11
|
|
Flux Content %
|
11.5±0.5
|
11.5±0.5
|
JIS Z 3197-8.1.2
|
|
Chlorine Element Content %
|
0.02±0.01
|
0.08±0.02
|
Potential Difference Automatic Titration
|
|
Copper Plate Corrosion
|
No
|
No
|
JIS Z 3284-4
|
|
Water Soluble ResistanceΩ
|
＞5×104
|
＞5×104
|
JIS Z 3197-8 .1.1
|
|
Insulation ResistanceΩ
|
＞1×1011
|
＞1×1011
|
JIS Z 3284-14
JIS Z 3284-3
|
The metal components of HSC-4H and HSC-4A
|
Sn%
|
- Bi%
|
Ag%
|
Cu%
|
Pb%
|
Sb%
|
|
Margin
|
-≤0.10
|
3.0±0.2
|
0.5±0.05
|
≤0.05
|
≤0.12
|
|
Zn%
|
Fe%
|
Al%
|
As%
|
Cd%
|
-
|
|
≤0.002
|
≤0.02
|
≤0.002
|
≤0.03
|
≤0.002
|
Compared HSC-4H with HSC-4A:
|
|
HSC-4H
|
HSC-4A
|
|
Shelf Life
|
There are 6 months from the date of manufacture in the cold and airtight conditions.
|
There are 8 months from the date of manufacture in the cold and airtight conditions.
|
|
Features
|
①This product adopts our company's newly developed flux and has excellent viscosity stability
|
①This product adopts our company's newly developed flux and has an excellent performance in viscosity stability.The shelf life is 2 months under normal temperature (<35℃). It is convenient to transport and store.
|
|
②A long time of printing, the viscosity changes are also seldom and could be recycled to use. E.g.: Take 500g solder paste and put them on the template, print about 4 hours every time, add 250g new solder paste. After 8 hours' continuous printing, recycling the residual solder paste that is on the template with the airtight container. Refrigerate after 16 hours, get it out to re-use.
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②The product has excellent viscosity when it is used continuously in high temperature and high humidity environment.
|
|
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③Maintain good adhesion for a long time (24h). Even for rest and other reasons to stop one hour, it still can maintain the same stable printability.
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③Printing 7 days continuously, this product still maintain excellent performance and reduce consumption.
|
|
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④The product because of its unique composition, it won't collapse in the preheating zone. Also it won't appear to bridge joint or solder ball splash.
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④Reduce the void rate and solder ball effectively.
|
|
|
⑤As our company adopts the unique
compound surfactant, greatly improved the chip component and the effect of QFN parts electrode on the tin, effectively prevent the phenomenon of BGA and other false solder paste. And can also reduce the incidence of solder holes, void and solder ball effectively.
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⑤Effectively restrain the virtual welding
like BGA's happening.
|
|
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⑥As our company adopts the unique flux, the solder joint is bright, the amount of the residue is extremely low and transparent. Has a very high reliability. Even without cleaning can also meet the requirements.
|
|
Product Packaging Specifications: 5/kg, 10/kg