High quality heating material produces high temperature breezeing, precise controlling BGA soldering and unsoldering.

Movable heating head can move in all directions for easy operation.

Embedded industrial computer with touch screen interface, PLC control, real-time temperature curve displays,  both setting curve and real temperature curve display;

High resolution touch screen for visible operation and observation.

Industrial computer can save setting temperature curves in great qty; analyses curve on the touch screen, both English and Chinese can be input.

External mouse can be connected for easier operation.

Upper/lower hot air can be precisely temperature-controlled by separately temperature setting; bottom IR constant heating zone secures safe rework.

BGA soldering zone supporting frame can be fine adjusted the height to prevent the depression of the soldering area.

Power cross flow fan cools lower heating zone instantly.

Multi-functions PCB fixing frame locates PCB quickly and easily as well as suitable for locating irregular shape board.

Hand vacuum suck pen easily picks away BGA, attached many kinds of different sizes alloy hot air nozzle to be replaced easily and can be customized based on practical needs.

PCB positioning with laser system makes PCB mounting easier and quickly.

Can be upgraded and create setting temperature curve automatically; non-professional people can operate easily.

Solid status working display function ensures temperature-controlling safe.

PCB Size:  W20*D20～W460*D370mm

Components: 2*2-60*60mm

Max weight chip: 80g

PCB fixing ways: Outer or frame

Bottom pre-heating: IR 2400W

Lower hot air heating: hot air 800W

Upper hot air heating: hot air 600W

Power: single-phase 220V, 50/60Hz

Machine size: L620*W600*H650mm