High quality heating material produces high temperature breezing, precise controlling BGA soldering and unsoldering.

Movable heating head can move to all directions for easy operation.

Upper/lower hot air, set up accurate temperature controlling with bottom IR constant temperature heating zone and reasonable temperature-controlling system ensuring safe reparation.

Upper hot air 8 segments temperature up(down) + 8 segments constant temperature control with 10 groups temperature setting savable. Lower hot air 8 segments temperature up(down) + 8 segments constant temperature control with 10 groups temperature setting savable and computer communication function is provided.

BGA soldering zone supporting frame can be fine adjusted the height to prevents the depression of soldering area.

Multi-function PCB fixing frame locates PCB quickly and conveniently as well as suitable for ­­­irregular shape board.  

Powerful cross flow fan cools down lower heating zone instantly.

Beep alarming function when soldering or unsoldering finished. Hand vacuum suck pen picks away BGA easily.

Equipped with over temperature alarming and protection function for both upper and lower heating zone.

Equipped with a couple of different sizes alloy nozzles that are easy to be replaced and can be customized based on practical needs.

Laser positioning setup makes fixing PCB more quickly and convenient.          

Solid status working can be displayed that secures safe temperature controlling.

PCB size: W20*D 20 ～ W460* D370mm

Component apply:  2*2-6 0*6 0mm

PCB fixing way: outer or frame

Bottom pre-heating: IR 2400W

Lower hot air heating:  Hot air 800W

Upper hot air heating :  Hot air 600W

Power apply: single-phase 220V, 50/60 Hz

Machine size:  L620* W600*H650mm