Product Main

Specifications

1. Features
  • Hot air head and mounting head 2 in 1 design, heating directly after mounting without moving PCB to avoid BGA being displacement, double speed-adjustable motor drive, manual hot air head move up and down.
  • Upper hot air head is with new style heating way with IR + hot air mix heating, the temperature goes up in high speed to make big temperature difference between the BGA to be unsoldered and around components that will not be affected, suitable best for the electronics with small spaces between components.
  • Upper and lower hot air and bottom IR heat separately, the heating time and temperature displayed on the touch screen.
  • Large and movable bottom pre-heats, PCB jig is adjustable by X and Y axes, the maximum PCB size is up to 550*
  • Bottom power cross flow fan cools down rapidly and safely
  • Color optical vision system with prismatic, double colors and zoom in and fine-adjusting function, aberration distinguish setting included, auto-focus, software operation, 27x optical zoom, Max BGA size 70*70mm and minimum 1.5 * 1.5 mm can be reworked.
  • Embedded industrial computer, touch screen interface, PLC control, real-time temperature curve display, display setting curve and practically-testing curve that can be analyzed.
  • Inbuilt vacuum pump, angle Φ rotates in 60°, precisely fine-adjusting mounting suck nozzle.
  • 8 segments up (down) temp + 8 segments constant temperature control, great memory capacity for temperature curves, analyze curves on the touch screen. 
  • Nozzle can detect placing heights with pressure controllable within 10 grams.
  • Many sizes alloy hot air nozzle, easy to replace, locate in any angles.
  • Color optical vision system moved by hand
  • Equipped with temperature-test port, real-time temperature monitoring and analyzing
2. Technical parameter
  • Model No: KD-R580
  • Maximum PCB size: W550*D500mm
  • PCB thickness: 0.5~2.5mm
  • Components: 1*1~70*70mm
  • Min IC pitch: 0.15mm
  • Max. mounting weight: 500g
  • Mounting accuracy: ±0.01mm
  • PCB fixing way: Outer
  • Working station fine-adjusting: forward/backward ±15mm, left/right±15mm
  • Temperature controlling way: K-type thermocouple, closed loop control
  • Lower hot air heating: hot air 800W
  • Upper hot air heating: hot air 1200W
  • Bottom pre-heating:   IR 3600W
  • Power: Single phase: 220V, 50/60 Hz
  • Machine size: L850*W750*H630mm
  • Machine weight: Approx 80KG