• Streamline shape design that looks beautiful and save room.  
• Hot air head and mounting head 2 in 1 design, stepping motor drives, auto-solder and unsolder functions
• Upper hot air is with 2 in 1 heating way that IR and hot air mix heat, temperature goes up in high speed that makes big temperature difference between the BGA to be removed and the components around, thus the components around will not be affected while unsoldering, suitable best for the electronics that is with very small space between components.
• Upper and lower hot air and bottom IR heat separately, the heating time and temperature will be displayed on the touch screen.
• Large and movable bottom pre-heats area, PCB fixing jig is adjustable with X, Y axes, the max PCB size is up to 550*500mm
• Bottom power cross flow fan cools down rapidly and safely.
• Color optical vision system is with prismatic double colors, zoom in and fine-adjusting functions, aberration distinguish setting included, auto-focus, software operation, 27x optical zoom, apply for the size range max 70*70mm – min 1.5*1.5mm.
• Embedded industrial computer, touch screen interface, PLC controlling, real-time temperature curve display, displays setting curve and practically-tested curve that can be analyzed.
• Built-in vacuum pump, angle Φ rotates within 60°, precise fine-adjustable mounting nozzle.
• 8 segments up(down) temperature + 8 segments constant temperature control, can save great many of temperature curves, analysis can be carried out on touch screen.
• Nozzle can detect the heights when picking and placing, the pressure is controllable in tiny range.
• Many sizes alloy hot air nozzle, easy to replace, locating in any angles.
• Color optical vision system moves automatically with motor drive
• Locating chips automatically with jigs with locating scales.
• Temperature testing port, real-time monitoring and analyzing

• Style No: KD-R700
• Max PCB size: W20*D20~W350*D350mm
• PCB thickness: 0.5~4mm
• Components: 1*1~70*70mm
• Min. IC Pitch: 0.15mm
• Mounting max weight:  500g
• Mounting accuracy:     ±0.01mm
• PCB fixing way: Outer
• Working station fine-adjusting: forward/backward ±10mm, left/right±10mm
• Temperature controlling way: K-type thermocouple, closed loop control
• Lower hot air heating: hot air 800W
• Upper hot air heating:  hot air 1200W(110V)
• Bottom pre-heating: IR 3600w
• Power: single phase: 220V, 50/60 Hz
• Machine size: L760*W630*H710mm
• Machine weight: around 60KG