1.10 layer PCB board
2.Immersion gold
3.Min hole:0.1mm
4.Blind Vias & Impedance control
5.Certificates:UL,ISO,RoHS,TS16949
2.Immersion gold
3.Min hole:0.1mm
4.Blind Vias & Impedance control
5.Certificates:UL,ISO,RoHS,TS16949
|
No.
|
Items
|
Spec
|
|
1
|
Layers
|
1-24 layer PCB board
|
|
2
|
Material Type
|
FR1-1;FR4;CEM-1;CEM-3;Rogers
|
|
3
|
Finish Plating
|
HASL,LF-HASL,ENIG,OSP,Immersion Silver,Immersion Tin,Immersion Nickel,Hard Gold
|
|
4
|
Material Thickness(in inches)
|
0.063";0.080";0.093"0.125";0.220";0.047";0.031";0.020";0.005"
|
|
5
|
Copper weight
|
Outer:up to 7OZ;Inner:up to 4OZ
|
|
6
|
Max.finished board size(in inches)
|
22"*28"
|
|
7
|
Trace/Space width
|
3/3 mil
|
|
8
|
Smallest pad size
|
12 mil
|
|
9
|
Smallest Hole(Finished)
|
4 mil laser
|
|
10
|
Gold Fingers
|
1 to 4 Edge(30 to 50 Micron Gold)
|
|
11
|
Profiling
|
Punching,Routing,V-CUT,Beveling
|
| 12 | Shape tolerance | ±0.13 |
| 13 | Hole tolerance | PTH ±0.076 NPTH:±0.05 |
| 14 | Copper thickness in hole | >25.0μm(>1mil) |
|
15
|
Special Requirements
|
Buried & blind vias+Controlled impedance+BGA
|