Compliances: MIL-STD-883,MIL-STD-750
Applications:Used to detect lead chip bonding inside
electronic components, lead-substrate bonding
strain,chip-substrate shear stress and etc.
Model HA-10
Test mode
Nondestrucitve
Nondestructive force limit values can be preset
Destructive
Limit values can be preset to protect force-exerting unit
Stress test range
0.1g-10kg(sensors of different scales are available )
Test result is liquid dispalyed, and data can be printed.
Jigs of DIP, F, B or other packages
 Size 400mm*550mm*500mm