HAOAO production of HT series X-ray inspection equipment is used to detect BGA, CSP, flip chip, semiconductor and other electronic components designed for the welding defect resolution X-ray detection equipment. SMT process can be applied to the development, production process monitoring and rework stations.

International manufacturing standards
Excellent detection performance
Superior cost
High return on investment

Features:
Price / performance
Small / easy to move
Ergonomic Design
Detection range
Dual format high-resolution intensifier
Plane enhancer (optional)
High magnification

Multi-angle measurement (option)
Multi Image Analysis Software
Simple interface
Windows XP operating system
Easy maintenance
Easy to install.