Product Main

Specifications

 fast detection speed, real 100% solder paste inspection can meet the process requirements; 
advanced three-dimensional computational model can accurately measure the printed solder paste height, area, volume, offset and short circuit;

Positioning quick and easy production of teaching models and program schedule; 
Analysis of reliable data and charts (SPC), is easy to grasp the reasons for the occurrence of negative phenomena; 
to color grayscale display status screen printing solder paste, solder paste printer support and timely feedback of adjustment; 

Good repeatability and reproducibility (GR & R <10%), contribute to the stability and improvement of the process;

? 8 mils can accurately measure small CSP components, and with good reproducibility; 

solder paste height, area, volume and timely detection of offset and other information, test results analysis (SPC).