fast detection speed, real 100% solder paste inspection can meet the process requirements;
advanced three-dimensional computational model can accurately measure the printed solder paste height, area, volume, offset and short circuit;
Positioning quick and easy production of teaching models and program schedule;
Analysis of reliable data and charts (SPC), is easy to grasp the reasons for the occurrence of negative phenomena;
to color grayscale display status screen printing solder paste, solder paste printer support and timely feedback of adjustment;
Good repeatability and reproducibility (GR & R <10%), contribute to the stability and improvement of the process;
? 8 mils can accurately measure small CSP components, and with good reproducibility;
solder paste height, area, volume and timely detection of offset and other information, test results analysis (SPC).
advanced three-dimensional computational model can accurately measure the printed solder paste height, area, volume, offset and short circuit;
Positioning quick and easy production of teaching models and program schedule;
Analysis of reliable data and charts (SPC), is easy to grasp the reasons for the occurrence of negative phenomena;
to color grayscale display status screen printing solder paste, solder paste printer support and timely feedback of adjustment;
Good repeatability and reproducibility (GR & R <10%), contribute to the stability and improvement of the process;
? 8 mils can accurately measure small CSP components, and with good reproducibility;
solder paste height, area, volume and timely detection of offset and other information, test results analysis (SPC).