1.  IC size min 1mm.
2.  Windows XP system,multi-languange interface ,operation easy with functional software.
3.  Aut operation.Heating suction and sucker working are controlled by computer.
4.  Welding ,mounting and countpoint positions all can be program and memory ,parameter limitless.
5.  Optics centring system made by special prism matching hi-precision auto focusing CCD for mounting .
6.  Three independent heating zone ,suitable lead free process,no nozzle.
7.  Upper heating zone,which heating by far infra made in Germany,and infra thermoscope from USA tests chip temperature,to achieve closed-loop control.
8.  Quality heating material at the botttom of bga ,which make hi-temperature with breeze that is superior to infra heating board only.
9.  It adapts far infra heating board to pre heat in the 3rd zone,prevent PCB deformation.
10.Big flow constant current cools PCB after heating ,prevent PCB deformation.
11.Sound hint function for bga disassemble and welding.
12.Vacuum pen takes out bga .Convemient and durable.
13.Special pallet is for different PCB board.
14.Panasonic PLC ,temperature better control .
15.CCD vision system avaible ,surveying the precess of bga tin ball melting and reflow.