1. Two independent heating zones,multitude temperature zones control ,lead free process.
2. Top heating zones use to infrared .
3. The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
4. Six-section temperature controls, simulates re-flower effect completely.
5. Cools PCB after heating ,to prevent PCB deflection.
6. BGA welding on completion of the demontion ,a voice prompt.
7 Vacuum wand sucks BGA ,convenient ,reliable and durable.
8. Card board with a special tooling for a wide variety of notebook motherboard(option).
9. COM connection ,connect with computer to achieve hi-end rework function.
2. Top heating zones use to infrared .
3. The bottom zone applies to far infrared to pre-heating to prevent PCB curve.
4. Six-section temperature controls, simulates re-flower effect completely.
5. Cools PCB after heating ,to prevent PCB deflection.
6. BGA welding on completion of the demontion ,a voice prompt.
7 Vacuum wand sucks BGA ,convenient ,reliable and durable.
8. Card board with a special tooling for a wide variety of notebook motherboard(option).
9. COM connection ,connect with computer to achieve hi-end rework function.