This unit is for grinding the discarded wafer and overall wastage from the whole process of the wafer making to through high speed blade. It is very functional for all this grinding power can be used as cream sandwich so as to minimize the overall wastage.

·Technical parameter:

·Material: all adopt 304 Stainless Steel

·With safe protective device, use SEW motor

·Grinding Capacity: 15~60 kg (in according to the clients’ requirement)

·Dimension: 900×750×1000mm

·Total Power: 3kW