Thermal tape
Good adhesion strength and superior thermal conductivity efficiency
Good choice for thermal materials
Good adhesion strength and superior thermal conductivity efficiency
Good choice for thermal materials
Features & Benefits:
-High bond strength to surfaces
-Thermal conductive
-Different thickness available
Typical Application Includes:
-DDR RAM assembly
-LED Lighting
Configurations:
-Sheet form/roll form/die-cut parts
Available Thickness:
-0.05,0.1, 0.15, 0.2mm -Max.width:1030mm
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Properties
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8N12-T05
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8N12-T10
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8N12-T15
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8N12-T20
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Carrier
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NONE
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NONE
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NONE
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NONE
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Thickness
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0.05mm
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0.10mm
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0.15mm
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0.20mm
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Adhesion
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Peel Strength
(PSTC-101)(N/25mm)
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>10.78
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>13.72
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>13.72
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>15.68
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Temp Resistance(S)
°C (°F)
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180(356)
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180(356)
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180(356)
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180(356)
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Temp Resistance(L)
°C(°F)
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120(248)
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120(248)
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120(248)
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120(248)
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Continues Use. Temp.
(°C)
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-20 to 120
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-20 to 120
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-20 to 120
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-20 to 120
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Retention
(1Kg/Inch/25°C)
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>48
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>48
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>48
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>48
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Adhesion(Kg/Inch)
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1.1
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1.4
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1.4
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1.4
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Initial Adhesion(J.DOW)
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8
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12
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14
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16
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Electrical
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Breakdown Voltage(Kv)
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1.57
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2.22
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2.55
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4.29
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Thermal
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Thermal conductivity
(ASTM D5470)
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1.2w/m.k
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1.2w/m.k
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1.2w/m.k
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1.2w/m.k
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Thermal Resistance
(AMD 2240)@40PSI
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0.414C*in2/w
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0.558C*in2/w
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1.07C*in2/w
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1.173C*in2/w
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