LED Silicone Package Material AP-G1426A/B

1, Introduction:
AP-G1426A/B is double component, adduct cured silicon material, uses for LED package and fill. After curing, it has high light transmittance, good heat-stability, small stress and low hygroscopicity etc..

2, Technical parameter:
Item Technical parameter Before Curing (A component) Appearance Colourless transparent liquid Viscosity mPa• s(25℃) 1300 Before Curing (B component) Appearance Colourless transparent liquid  Viscosity mPa• s(25℃) 800 Mix ratio 1: 1 Mix-viscositymPa• s(25℃) 1100 Typical curing condition 25℃× 12h(70℃× 1h) Operate time(25℃) 90min After curing Refractive(25℃) 1.42 Transmittance(％, 450 nm) ﹥95 penetration(mm/10) 220～270

3, Usage:
A, B=1: 1, can only be used after you remove the bubble in the conditionof 10mmHg vacuum. Please operate in dry and clear.

4, Attentions:
Some of materials, chemical, curing agent, plasticizer can control the gel material’ s curing. There are are including:
1, organotin and other metallorganic compound
2, sulphur, polysulfide, polysulfone and other sulfur-containing
3, amine, polyester rubber and other ammoniac
4, phosphorig and other phosphorig-containing If any doubt that whether some kind of material would restrain the curing, we suggest a compatibility experiment test for the suitability. If the uncured packaging materials exist the surface of the curing ones, then the curing incompatible, restrain curing.