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Specifications

LED Silicone Package Material AP-G1418A/B
1, Introduction:
AP-G1418A/B is double component, adduct cured silicon material, uses for LED package and fill.  After curing, it has high light tranmittance, good heat-stability, small stress and low hygroscopicity etc.
2, Technical parameter:
Item Technical parameter Before Curing (A Component) Appearance Colourless transparent liquid Viscosity mPa•s(25℃) 1200 After Curing (B Component) Appearance Colourless transparent liquid Viscosity mPa•s(25℃) 900 Mix ratio 1: 1 Mix Viscosity mPa•s(25℃) 1100 Typical Curing condition 25℃×12h(70℃×1h) Operate time(25℃) 90min After Curing Refractive(25℃) 1.42 transmittance(%, 450 nm) ﹥95 penetration(mm/10) 120~170
3, Usage:
A, B=1: 1, can only be used after you remove the bubble in the conditionof 10mmHg vacuum.Please operate in dry and clear.
4, Attentions:
Some of materials, chemical, curing agent, plasticizer can control the gel material’s curing. There are are including:
1, organotin and other metallorganic compound
2, sulphur, polysulfide, polysulfone and other sulfur-containing
3, amine, polyester rubber and other ammoniac
4, phosphorig and other phosphorig-containing If any doubt that whether some kind of material would restrain the curing, we suggest a compatibility experiment test for the suitability. If the uncured packaging materials exist the surface of the curing ones,then the curing incompatible, restrain curing.