PCB Printed circuit board manufactory
Material
 FR-4 (UV, Halogen Free, High Tg), CEM-3, CEM-1
 
No. of layer
 1-8
 
Laminate thickness
 0.4 to 3.2mm
 
Maximum panel size
 18 x 24 sq.inch
 
Min./Max.drill size
 0.3 – 6.5mm
 
Aspect Ratio
 6:1
 
Hole tolerance/registration
 +/-0.10mm
 
Pad diameter
 min. 0.30mm ＋ max. finished hole size
 
Imaging
 Dry Film
 
Line width/Line spacing min
 3 mil (0.075mm) – UL approved
 
Minimum SMT pitch
 16 mil (0.40mm)
 
Plating (Additive Method)
 Immersion Ag, Lead free HASL, OSP, ENIG, Electroplating Flash gold/Bondable gold, HASL
 
Solder mask
 Liquid Photo Imageable (LPI)
 
Option
 Polymer Thick Film (PTF), Blue peelable mask, Carbon Keypads, V-cut/Scoring, Push back
 
Electrical Tests
 Net list testing c'mos and dual access test fixture 
Voltage 100 - 300 VDC
Isolation  1MΩ - 100 MΩ 
Continuity 5 - 100 Ω 
 
HASL Board
No clean process
 Below 6.4 ug NaCl/ sq. in. at room temperature
 
Outgoing quality checking
 Monitored by COA and external ppm, according to EN/WS001; IPC-A-600; customer requirements
 
Quality standard/system
 IPC-A-600, IPC-M-105, ISO/TS16949, ISO9001, ISO14001, QC080000
 
Service
 Panelization Drawings
Gerber Editing
CAD work station, DRC,
Unit arrangement to panel form
(Scored format, Tab break away format)
Re-arrangement of panel size