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Specifications

3*3 Type  
Features:
Improve mounting density of components on PC board.
Reflow soldering
Contacts are completely sealed, enhance reliability.
Available with ground terminal for electrostatic prevention.
Packaged with a 12mm wide taping.
Applications:
For operating various mobile devices.
For operating various devices that require high density mounting such as mobile phones, communication devices, compact electronic devices.
Specification:
Items        Standard
Rating       50mA 12V DC
Insulation resistance  100MΩmin. 100V DC
Dielectric strength   250V AC for 1min.
Contact resistance   100MΩmax.
Operating temperature range    -30℃ to +85℃
Lifetime        100,000 cycles min.
Operating Force  A:90gf B:180gf C:250gf
Travel     0.20±0.1mm