1. Electroplating grade
|
CuO
|
98.5%min
|
|
Zn
|
100ppm max
|
|
Fe
|
100ppm max
|
|
Pb
|
60ppm max
|
|
Cl
|
100ppm max
|
|
Acid-insoluble
|
≤0.01%
|
2. Electronic Grade
|
CuO
|
98%min
|
|
Hydrochloric acid insoluble
|
≤0.2%
|
|
Water soluble matter
|
≤0.1%
|
|
Cl
|
≤0.2%
|
|
So
|
≤0.2%
|
|
Cd
|
≤5ppm
|
|
Pb
|
<100ppm
|
|
Hg
|
<2ppm
|
|
Cr VI
|
<2ppm
|
3. Industrial Grade
|
CuO
|
98%min
|
|
Water soluble matter
|
≤0.1%
|
|
So
|
≤0.2%
|
|
Hydrochloric acid insoluble
|
≤0.2%
|
|
Cl
|
≤0.2%
|