Item |
Producing capability |
layer | 1-6 lays(including rigid and flexible circuit) |
panel size | max:250*400(mm) |
drilling diameter |
Max. Diameter: 6.5mm (256mil) Min. Diameter: 0.20mm (8mil) |
Base Material Copper Thickness |
Max.: 3oz Min.:1/3oz |
Insulating Layer Thickness |
Max.: 0.05mm(PI) (2mil) Min: 0.0125mm(PI) (0.5mil) |
Electroplating Au Thickness | >0.03 um |
Chemical Immersion Ni/Au Thickness | 0.03 um --- 0.1 um |
Electroplating Sn Thickness | 3 um --- 20 um |
Etching Line Width & Space: |
S/S: 2mil (0.05mm) D/S: 2.5mil (0.075m) |
Etching Tolerance | Width:20%; Special Width: 10% |
Outline Tolerance(from side to side) | 0.2mm +/- 0.05mm(8mil +/- 2mil) |
Parts Fixed Position Tolerance | 0.2mm (8mil) |
Finishing Treatment |
Immersion Gold, Immersion Tin Plating Gold, Plating Tin OSP, etc. |
Soldermask | Green,White,Black |
E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |