Pf6301 Modified resin binder
It’s a modified phenolic resin binder,using for producing Insulation materials,for example Insulation panel.it’s thermosetting adhesive, so it doesn’t need to add curing agent. curing temperature is 200-230℃.
Technical index
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Appearance
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Fineness
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FreePhenol
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Softening point
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Moisture
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Yellow or light red
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0.106mm
≥90%
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≤1.5%
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100-110℃
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≤1.5%
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