Pf6301 Modified resin binder
It’ s a modified phenolic resin binder, using for producing Insulation materials, for example Insulation panel. It’ s thermosetting adhesive, so it doesn’ t need to add curing agent. Curing temperature is 200-230℃.
Technical index
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Appearance
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Fineness
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FreePhenol
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Softening point
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Moisture
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Yellow or light red
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0.106mm
≥ 90%
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≤ 1.5%
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100-110℃
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≤ 1.5%
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