Item    Technology for production capability
Surface finish    HASL/Lead free HASL/Ni gold plating/Immersion/Golden finger/OSP/Carbon ink
Max PCB Size    600mm*600mm
Min PCB Size    5mm*5mm
Tolerance for Bow and Twist     single layer≤1.0%,double layer≤0.6%,multilayer≤0.6%
Min board thickness&Tolerance    0.2mm±0.08mm
Min Line Wide/Line spacing& Tolerance    "HASL:0.10MM±20%(4mil±20%)
Gold Board:0.075mm±20%(3mil±20%)"
The distance between the copper and board edge    0.5mm(20mil)
The distance between Hole edge and board edge    0.3mm(7.87mil)
Min hole diameter&tolerance    0.2mm±0.076mm(12mil±3mil)
copper thickness in the hole    20-25um(0.79-1.0mil)
hole location devation    ±0.076mm(0.3mil)
Min diameter for the round hole(punch)    "Board thickness for FR-4: less than1.0mm(40mil)1.0mm(40mil)
Board thickness for FR-4:1.2-3.0mm(47mil-120mil)1.5mm(59mil)"
Min diameter for the square slot(punch)    "Board thickness less than 1.0mm for FR-4,CEM-3:0.8mm*0.8mm(31.5mil*31.5mil)
Board thickness1.2-3.0mm(47mil-120mil) for FR-4,CEM-3(47mil-120mil):1.0mm*1.0mm(40mil*40mil)"
Silk screen circuit devation    ±0.076mm(0.3mil)
The tolerance for route    CNC:±0.1mm(±4mil),Punch:±0.15mm(±6mil)
The tolerance for V-cut    ±0.2mm(±8mil)
Type    Double layer,multilayer,aluminum,ceramic,PTFE
Material    Fr-4,CEM-1,CEM-3,High frequency board
Processing thickness    0.2mm-3.5mm
base copper thickness    18um,35um,70um
Min hole diameter     0.25mm
Plating thickness    "gold plating:2.5-5um Au0.05-0.1um
Immersion gold:Ni5-8um Au 0.08-0.12um
Golden finger:Ni2.5-5um Au0.08-0.12um"
Production Capability    30000 squremeter/Month
Outline     CNC,punch
V-cut angle devation    ±5°
Material thickness'range for V-cut    0.6mm-3.2mm(15.5mil-129.58mil)
Min spacing of SMD    0.33mm(12mil)
Min clearance of solder mask    0.076mm(0.3mil)
Min solder mask bridge    ±0.076mm(0.3mil)