Item	Technology for production capability
Surface finish	HASL/Lead free HASL/Ni gold plating/Immersion/Golden finger/OSP/Carbon ink
Max PCB Size	600mm*600mm
Min PCB Size	5mm*5mm
Tolerance for Bow and Twist	single layer≤1.0%,double layer≤0.6%,multilayer≤0.6%
Min board thickness&Tolerance	0.2mm±0.08mm
Min Line Wide/Line spacing& Tolerance	HASL:0.10MM±20%(4mil±20%) Gold Board:0.075mm±20%(3mil±20%)
The distance between the copper and board edge	0.5mm(20mil)
The distance between Hole edge and board edge	0.3mm(7.87mil)
Min hole diameter&tolerance	0.2mm±0.076mm(12mil±3mil)
copper thickness in the hole	20-25um(0.79-1.0mil)
hole location devation	±0.076mm(0.3mil)
Min diameter for the round hole(punch)	Board thickness for FR-4: less than1.0mm(40mil)1.0mm(40mil) Board thickness for FR-4:1.2-3.0mm(47mil-120mil)1.5mm(59mil)
Min diameter for the square slot(punch)	Board thickness less than 1.0mm for FR-4,CEM-3:0.8mm*0.8mm(31.5mil*31.5mil) Board thickness1.2-3.0mm(47mil-120mil) for FR-4,CEM-3(47mil-120mil):1.0mm*1.0mm(40mil*40mil)
Silk screen circuit devation	±0.076mm(0.3mil)
The tolerance for route	CNC:±0.1mm(±4mil),Punch:±0.15mm(±6mil)
The tolerance for V-cut	±0.2mm(±8mil)
Type	Double layer,multilayer,aluminum,ceramic,PTFE
Material	Fr-4,CEM-1,CEM-3,High frequency board
Processing thickness	0.2mm-3.5mm
base copper thickness	18um,35um,70um
Min hole diameter	0.25mm
Plating thickness	gold plating:2.5-5um Au0.05-0.1um Immersion gold:Ni5-8um Au 0.08-0.12um Golden finger:Ni2.5-5um Au0.08-0.12um
Production Capability	30000 squremeter/Month
Outline	CNC,punch
V-cut angle devation	±5°
Material thickness'range for V-cut	0.6mm-3.2mm(15.5mil-129.58mil)
Min spacing of SMD	0.33mm(12mil)
Min clearance of solder mask	0.076mm(0.3mil)
Min solder mask bridge	±0.076mm(0.3mil)
Cut lamination→Drilling→Deburring→Desmear→PTH→Dry film→Imagine transfer →Plating→Eching→Solder mask→Silk screen→Surface finish→Punch/CNC→V-cut→Cleaning→E-Test→Visual inspection→Packing→QC→FQA→Shipment