We provide a full system assembly service for products. Please give us an idea, we will meet all your needs.
Machine and hand placement capabilities, which include:
- Placing packages as small as 0201
- BGA, SOIC, PLCC, QFP are all standard packages for us
- We can also handle ultra fine pitch to 0.015”
- AOI equipment ,Function Test
- Prototype through pre-production and small volume to high volume capacity
Our expertise with SMT assembly combined with through-hole, mixed technology, wire harnessing electro-mechanical assembly make Hua Xing the optimum choice for all your assembly requirements
Machine and hand placement capabilities, which include:
- Placing packages as small as 0201
- BGA, SOIC, PLCC, QFP are all standard packages for us
- We can also handle ultra fine pitch to 0.015”
- AOI equipment ,Function Test
- Prototype through pre-production and small volume to high volume capacity
Our expertise with SMT assembly combined with through-hole, mixed technology, wire harnessing electro-mechanical assembly make Hua Xing the optimum choice for all your assembly requirements