corrosion for semiconductor wafer cleaning; own exhaust gas treatment device;

1) through chemical reactions that consume the material, using chemically reactive gases or plasma; 

2) physical removal of the material, usually by momentum transfer; 

3) a combination of both physical removal and chemical reactions.

 

A. Module design;Depending on customer requriment and process,offer special solution;

B. Customization based on customer budget;

C. Optimum wet cleaning solution;

D. High PPR;

E.Various options available:;

F. Operator friendly and safe;

G. Easy maintenance;