1> FPC Processing Details:
Multilayers FPCboard,printed circuit board
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Place of Origin Huizhou China (Mainland)
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Brand Name: winscon-FPC
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Model Number: 2 layers pcb
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Base Material: PI
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Copper Thickness: 1oz
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Board Thickness: 0.5mm
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Min. Hole Size:0.3 mm
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Min. Line Width: 0.135mm
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Min. Line Spacing: 0.16mm
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Surface Finishing: OSP,HASL ( Lead Free )
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Soldermask: Gold
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Legend: White
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Test: E-testing
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2> FPC Package & Delivery:
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Packing details:
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vacuum packing, export carton
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Delivery time:
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3-7 days
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3>FPC Fabric Capacity:
| Item | Producing Capability |
| Layers | 1-20(Including Rigid and Flexible Circuit) |
| Panel Size | Max:500*550(mm) |
| Drilling Diameter |
Max.Diameter:6.5mm(256mil) Min.Diameter:0.20mm(8mil) |
| Base Material Copper Thickness |
Max:3 oz Min:1/3 oz |
| Insulating Layer Thickness |
Max:0.05mm(PI)(2mil) Min:0.0125mm(PI)(0.5mil) |
| Electroplating Sn/Pb Thickness | 3μm---20μm |
| Electroplating Au Thickness |
Au:≥0.05μm
Ni:1μm-5μm
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| Chemical Immersion Ni/Au Thickness | 0.05μm----0.1μm |
| Electroplating Sn Thickness | 3μm---20μm |
| Erching Line Width & Space |
S/S:2.5mil(0.06mm) D/S:2.5mil(0.06mm) |
| Etching Tolerance |
Width:±20% Special Width:±10% |
| Outline Tolerance(from side to side) | ±0.05mm(±2mil) |
| Parts Fixed Position Tolerance | ±0.2mm(8mil) |
| Product Catalog Surface Finish |
1.Electrical/Immersion Ni&Au Plating Board 2.Electrical/Immersion Tin Plating Board 3.OSP Board |
- FPC(flexible board)
- Any kinds FPCs from 1 to maximum 20
- Specializing in high-tech multilayer
- Large production capability
- Professional engineering assistance, including design rule check of customer data
- In-house FPC R and D center
- Quick turnaround
- Quick Turn, OEM FPC Board
4>FPC board electric applications:
For LCD monitors and LCD TV sets
For military systems
For notebook computers' main board
For multimedia devices (such as MP3/MP4 players and PDAs)
For home use electric application
For mobile phones
If you send us your Gerber Files and PCB specifications, we will quote for you within 12 hours.
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