1) is mainly used for semiconductor wafer cleaning corrosion;
2) standard etching process (using HF/HNO3, KOH, NaOH, H3PO4, BOE, DHF, SPM, SOM, etc.);
3) Control mode: manual , semi-automatic, automatic;
4) Material: according to customer requirements and technology selection, optional PP, PVC, PVDF, quartz, stainless steel and other materials;
2) standard etching process (using HF/HNO3, KOH, NaOH, H3PO4, BOE, DHF, SPM, SOM, etc.);
3) Control mode: manual , semi-automatic, automatic;
4) Material: according to customer requirements and technology selection, optional PP, PVC, PVDF, quartz, stainless steel and other materials;
Advantages and Features:
Modular design; based on your process and needs, to provide you with a special design; customized according to customer's budget; the best cleaning Treatment Process; cost-effective; many modules for the election; user-friendly interface; safety and environmental protection; easy to maintain; non-standard products, welcome your specific needs based on detailed consultation!