PCB Design Capabilities
Max Layers: 28

Max connection number: 30000

Max Pin number: 40000

Max BGA designed number: 44

Highest speed signal: 10G

Min BGA space: 0.4mm

EMC design: CE, FCC

HDI design: blind burying hole, hole on pad, imbedded capacitor, imbedded resistor

FPC design: 20 layer rigid-flex PCB

FPC design: DFM, DFA, DF, DFC
High Speed and High Density PCB Design
High Speed Backplane Design
Probe Card
Mother Board and Mobile Phone Design
Industrial and ATE Board