1. Layer Count: 1-22 layers HDI
2. Material: CEM1, CEM3, FR-4, High TG FR4, halogen-free FR4, aluminium, ceramic etc.
3. Maximum Size: 610mm× 1200mm
4. Board thickness: 0.125mm-6.0mm
5. Minimum Line/Space: 0.075mm
6. Minimum Drilling Hole(Mechanical): 0.15mm
7. Minimum Laser Hole: 0.075mm
8. Copper Thickness: 17µ M-175µ M
9. Mini Solder Mask Bridge: 0.025mm
10. Impedance Control Tolerance: L. ± 5%
11. Surface finishing: HASL, LEAD-FREE HASL, Immersion gold, Immersion tin, Immersion Silver, Plated gold, OSP, Carbon ink.
12. Solder Mask Color: Green, Red, White, Yellow, Black, Blue.
13. Quality Standards: IPC-A-600F and MIL-STD-105D China GB4588
14. Inner Packing: Vacuum packing/Plastic bag Outer Packing: Standard Carton Packing
15. Special Requirements: Buried and blind vias+controlled impedance+BGA
16. Provides OEM services to all kinds of PCBA as well as electronic encased products
17. Profiling: Punching, Routing, V-CUT, Beveling
18. Certificate: UL, ISO9001: 2000, ISO14001, SGS, RoHS
19. Shipping: FOB HK, CIF, Air Transportation, Sea Transportation, FedXe, DHL, UPS, TNT
20. Payment Terms: L/C, T/T