Product Main

Specifications

Resin bond diamond grinding wheels: Mainly used for machining tungsten carbide, ceramic materials, optics materials, silicon materials, magnetic materials and so on.
Resin bond CBN grinding wheels: Mainly used for machining high speed steel,cast iron and so on

Size available:
D:10-750mm
T:3-50mm
X:3-20mm
Any other size available according to customer's requirement.
Shape available:
Straight grinding wheel series
Straight cup, tapered cup, dish grinding wheel series
 
 
When you make an order, pls provide the following data:
Type, Sizes (Diameter, Thickness, Hole, Width and depth of abrasive layer, angle etc.), Bond, Grit, Concentration, Work piece material, Grinding process (wet or dry).