Enviromentaly Friendly High Quality Thermal Pad for CPU/LED
HY210 thermal pad is a high performance thermal conductivity materials,designed to meet the
LED lighting/CPU/VGA to reduce operating temperature of the thermal conductivity of the role.
HY210 thermal pad intrinsic viscosity,soft,good compression performance and excellent thermal conductivity.
Together with its low resistance and high cost performance characteristics are widely used in optoelectronic industry,
computer,high power LED lighting PCB board and heat sink.
Specification
|
Property
|
Range
|
UNIT
|
Test Method
|
|
Color
|
Dark red
|
------
|
Visual
|
|
Thickness
|
0.5-12
|
mm
|
ASTM D374
|
|
Specific Gravity
|
2.28 ± 0.2
|
g/cm3
|
ASTM D792
|
|
Hardness
|
20± 5
|
Shore A
|
ASTM D2240
|
|
Elongation
|
130 ± 13
|
%
|
ASTM D412
|
|
Tensile Strength
|
8 ± 2
|
Kgf/cm2
|
ASTM D412
|
|
Weight Loss
|
<1
|
@204°C/24Hr
|
------
|
|
Dielectric Breakdown Voltage
|
>1.5
|
KV/mm
|
ASTM D149
|
|
Volume Resistance
|
>1017
|
Ohm-meter
|
ASTM D257
|
|
Continuous Use Temp
|
-60-180
|
°C
|
------
|
|
Flame Rating
|
94V-0
|
UL
|
UL
|
|
Thermal Conductivity
|
3.2
|
W/m-k
|
ASTM D5470
|
Features Advantages
High reliability
Compressibility strong,soft and flexible both
High thermal conductivity
Natural viscosity,no additional surface adhesion
Through the environmental requirements of ROHS and UL
Easy to operate
Application method
Put the thermal pad affixed to the aluminum plate and the lighting source between the heat sink
Put the thermal pad affixed between the CPU/GPU surface and the heat sink
Application industry
Computer
LED application industry
Solar industry
Backlight industry
LCD-TV/PDP
High performance thermal pads for you,welcome your purchase!contact us right now!